Electronic paste is a thick film element manufacturing base material is a solid powder and an organic solvent made after three rolling mixed paste. Electronic paste as a new material, far superior to traditional electrical equipment (such as resistance wire, electric heating pipe, etc.), and environmentally friendly, efficient and energy-saving lamps features.
For electronic suspensions, we must first know the function of electronic paste is a filler, a binder and an organic carrier. Common constituent materials and feature the following table.
Electronic paste
Electronic suspensions according to the price level of the conductive phase can be divided into precious metals and base metals electronic pastes electronic slurry.
1. precious metals electronic pastes: Silver is the best electrical properties of metallic materials, usually in silver to add only trace metals, a relatively new technology is added to a slurry of metal compounds to improve the dispersion of the slurry, with the the rapid development of China’s electronics industry, Ag powder material will be widely used in various fields of electronic technology, chemicals, pharmaceuticals and the like.
2.Pd conductive paste: metal palladium also has good electrical conductivity, but within a pure palladium electrode paste used only for high-temperature sintering of multilayer ceramic capacitors and multilayer ceramic capacitors as to the direction of the development of the cryogenic medium, The amount of pure palladium conductive paste will continue to decrease.
3.Au conductive paste: Has developed various types of gold conductor paste mainly divided into three types: with a glass, containing only non-oxide glass, while gold conductor paste containing glass and oxides. No glass gold conductor paste is widely used in bonding aspect of the multilayer wiring conductor and high-power transistor chip and the lead frame.
4.Ag-Pd conductive paste: silver palladium conductive paste, the rate of diffusion of silver ions is only a fraction of silver, and even a number of low-level, Ag-Pd Pd content basis having conductive paste requirements may be, from 5% to 95% range, which 70Ag-30Pd conductive paste is commonly used in MLC electrode paste.
5.Au-Pd conductor system not only high adhesion strength. Weldability good, and can co-firing with Ag-Pd-based resistance paste, forming a low-noise exposure. Au-Pd conductor does not exist diffusion line, so often used for high reliability and multi-layer wiring applications.
Ni Slurry: Ni has good electrical conductivity, chemical stability and weldability, which is the main factor in determining the performance of an electrode slurry. Ni conductive paste is an ideal thick film conductive paste, but to ensure that the surface of Ni metal particles not oxidized at high temperature burning conditions, and high temperature sintering Ni powder sintered metal formed network structure, but with lower combined strength of the ceramic substrate, only by glass bonding.
Cu paste: Cu electrode paste has been developed mainly divided into three types: the glass-containing, added to the oxide-free glass, while the Cu electrode paste containing glass and oxides. Also make sure the surface of Ni metal particles not oxidized at a high temperature burning conditions. The current anti-oxidation technology mainly: Cu powder the surface of silver, the reducing agent slurry was added, the organic phosphorus compound Cu powder processing, dilute polymer solution treatment, coupling treatment and the like.
Zn slurry: usually the fine Zn powder, lead borosilicate glass frit in an organic binder to a certain percentage of the traditional method dubbed slurry. Zn powder can be used as an electrode material PTC thermistor, instead of Ag conductor paste can also greatly extend the life of a plasma display panel.