Semiconductor Components Used High Thermal Conductive B4C Micron Powder

                                   Semiconductor Components Used High Thermal Conductive B4C Nanopowder

Spec: 0.5um or 1-3um, 99% purity.

Application for B4C powder:

1. A neutron absorbing material and radiation: B elements with up 600barn neutron absorption cross section, is a nuclear reactor deceleration components - the main choice of material or a nuclear reactor control rod radiation components.

2. Composite armor materials: the use of its lightweight, super-hard and high modulus and other characteristics, as a light body armor and bulletproof armor material. Using B4C bulletproof agricultural production, compared with the same type of steel more than 50% lighter body armor. B4C Nanopowder is also the land of armored vehicles, helicopter gunships and armored bulletproof airliner important material.

3. The semiconductor element and the thermoelectric element industry: boron carbide ceramic having semiconductor characteristics and good thermal conductivity properties, can be used as high-temperature semiconductor components, can also be used in the semiconductor industry the gas distribution plate, the focus ring, microwave or infrared window , DC plugs. B4C and C high temperature thermocouple elements can be used in combination, the use of temperature up to 2300 ℃, but also can be used as anti-radiation thermoelectric elements.

4. Mechanical seal parts: superhard B4C and excellent wear resistance properties, making it an important material for mechanical seals. Because of its relatively high cost, mainly used in some special occasions, mechanical seals.

5.The nozzle material: high boron carbide hardness and excellent wear resistance, making it an important nozzle material. Boron carbide nozzle with a long life, relatively low-cost, time-saving, high efficiency and other advantages. Boron carbide nozzle life is several times alumina nozzle, the nozzle than the WC and SiC have high life many times.