Polishing and Grinding Properties of Nano Silicon Carbide

Silicon carbide (HW-D507) is produced by smelting quartz sand, petroleum coke (or coal coke), and wood chips as raw materials through high temperature in resistance furnaces. Silicon carbide also exists in nature as a rare mineral— named as moissanite. In high technology refractory raw materials such as C, N, B and other non-oxide , silicon carbide is the most widely used and the most economical one.

 

β-SiC powder has properties such as high chemical stability, high hardness, high thermal conductivity, low thermal expansion coefficient and so on. Therefore, it has excellent performances such as anti-abrasion, high temperature resistance and thermal shock resistance. Silicon carbide can be made into abrasive powders or grinding heads for high-precision grinding and polishing of materials such as metals, ceramics, glass and plastics. Compared with traditional abrasive materials, SiC has high wear resistance, hardness and thermal stability, which can effectively improve processing accuracy and efficiency. In addition, it has excellent chemical resistance and high-temperature stability, so it has a wide range of application prospects in various fields.

 

SiC can be used to prepare polishing materials, which has a wide range of applications in mechanical engineering, electronic devices, optical devices and other fields. This polishing material has excellent properties such as high hardness, high wear resistance and high chemical stability, which can accomplish high quality polishing and grinding operations. At present, the main grinding and polishing materials is diamond in the market, and its price is tens or even hundreds of times of β-Sic. However, the grinding effect of β-Sic in many fields is no less than diamond. Compared with other abrasives of the same particle size, β-Sic has the highest processing efficiency and cost performance.

 

As polishing and grinding material, nano silicon carbide also has excellent low friction coefficient and excellent optical properties, which are widely used in microelectronic processing and optoelectronic device manufacturing. Nano silicon carbide polishing and grinding materials can achieve extremely high polishing capabilities, while controlling and reducing surface roughness and morphology, improving the surface quality of the material and the performance of the product.

 

In resin-based diamond tools, nano silicon carbide is an important additive that can effectively improve the wear resistance, cutting and polishing performance of resin-based diamond tools. Meanwhile, the small size and good dispersion of SiC can improve the processing performance of resin-based diamond tools by mixing well with resin-based materials. The process of nano SiC for manufacturing resin-based diamond tools is simple and easy. Firstly, nano SiC powder is mixed with resin powder in a predetermined ratio, and then heated and pressed through a mold, which can effectively eliminate the uneven distribution of diamond particles by using the uniform dispersion property of SiC nanoparticles, thus significantly improving the strength and hardness of the tools and extending their service life.

In addition to the manufacture of resin-based diamond tools, silicon carbide nanoparticles can also be used in manufacturing various abrasives and processing tools, such as grinding wheels, sandpaper, polishing materials, etc. The application prospect of nano silicon carbide is very broad. With the increasing tendency of various industries to use high performance and high quality processing tools and abrasives, nano silicon carbide will certainly produce more and more extensive applications in these fields.

In conclusion, nano silicon carbide powder has a wide application prospect as a high quality polishing material. With the continuous progress of science and technology, nano silicon carbide and resin-based diamond tools will be continuously improved and upgraded to a wider range of fields.

 

Hwnanomaterial is a professional manufacturer of nano precious metal powders and their oxides, with reliable and stable product quality and excellent price. Hongwu Nano supplies SiC nanopowder. Welcome to contact us for further info.

Modification of Epoxy Resin by Silicon Carbide Whiskers (SiC-W)

Because of the small diameter, large aspect ratio, high strength, high modulus and excellent heat resistance, silicon carbide whiskers play a unique role in the modification of polymer materials. Epoxy resin has been widely used in various fields of the national economy because of its high strength, good adhesion, good thermal stability, high strength, and small shrinkage. SiC whisker modified epoxy resin can further improve its mechanical properties (strengthening and toughening), friction and wear resistance and antistatic properties.

 

Epoxy resin (EP) is one of the most widely used thermosetting polymer materials. It has excellent adhesion, thermal stability, electrical insulation, chemical resistance, high strength, small shrinkage, and low price and it’s widely used in various fields such as coatings, adhesives, light industry, construction, machinery, aerospace, electronic and electrical insulation materials, and advanced composite materials. However, due to the shortcomings of epoxy resin cured products such as high brittleness, low impact strength, easy cracking, and poor antistatic performance, its further applications are limited.

 

Epoxy resin glue is prepared by epoxy resin plus curing agent, filler and so on. It has the characteristics of high bonding strength, high hardness, good rigidity, acid, alkali, oil and organic solution resistance, and small curing shrinkage. At present, the bonding strength of epoxy adhesive is relatively high, but there are still some deficiencies in the bonding of some high-strength structures, and the bonding strength needs to be further improved.

 

Whiskers are fibers with extremely small diameters grown in the form of single crystals under special conditions. They have a highly ordered atomic arrangement structure, so they can approach the theoretical strength of valence bonds between atoms, and have great potential for strengthening epoxy adhesives. Many research results show that filling whiskers into epoxy resin matrix can effectively solve these shortcomings and greatly improve the comprehensive performance of epoxy resin.

 

Silicon carbide whisker is a cubic whisker whose crystal form is the same as that of diamond. It is currently the whisker with the highest hardness, the largest modulus, and the best heat resistance among whiskers. The crystal form is β-type, which has higher hardness, better comprehensive properties such as toughness and thermal conductivity, and is also one of the best reinforcing and toughening materials. It can significantly improve the toughness, flexural strength, hardness, wear resistance, and high temperature resistance, oxidation resistance, thermal conductivity, structural stability, thermal shock resistance, etc..

 

The silicon carbide whiskers treated with the coupling agent can be well and stably dispersed in the matrix, the whiskers are well infiltrated by the matrix, and the interface bonding strength is increased. Through this interface, the matrix and whiskers are connected as a whole. When the matrix is ​​subjected to external force, the stress can be uniformly transmitted through this interface and absorb a large amount of energy. On the one hand, when a crack appears in the matrix, the whiskers bridge the surface of the broken crack, which can hinder the further development of the crack; on the other hand, if the crack encounters silicon carbide powders, if it wants to develop further, the crystal must be destroyed or removed. Whiskers have high strength and high modulus, and it takes a lot of energy to destroy or pull out the whiskers, and when the crack bypasses the whiskers, it develops further and causes more microcracks. And because the whiskers have a relatively large L/D, more energy needs to be absorbed, thereby significantly increasing the strength and toughness of the EP matrix.