The choice of the particle size of silver powder for conductive adhesive

With the rapid development of electronic technology, conductive adhesive, as a kind of electronic interconnection material, is increasingly used in surface packaging and chip interconnection. As a substitute for traditional Sn/Pb solder, conductive adhesive has the advantages of low curing temperature, simple process, and environmental protection.

 

Conductive adhesive is an adhesive formed by dispersing conductive particles in a resin matrix. After curing and drying, it has conductive properties similar to metals. It has a certain bonding performance. By bonding different conductive materials together, a conductive path is formed between these materials to conduct electricity. Before curing, the conductive adhesive is a paste-like glue that can flow, and can be cured by heating and ultraviolet light, and the cured product meets certain properties, such as stable electrical conductivity and certain shear strength.

 

According to the conductive mechanism of conductive adhesive, the general selection principle is: more contact area can be formed between particles. There are many shapes of silver powder, such as flake, spherical, dendritic, irregular shape, etc. Different silver powders can be selected according to different uses. Generally, flake silver powders are mostly used in conductive adhesives, and the diameter is usually between 1-10um. Hongwu Nano can customize different specifications, such as the particle size, SSA, apparent density, of flake conductive silver powder for customers. For example, the flake silver used for LED dispensing and touch screen circuits has key differences in parameters and performance.

 

HONGWU is the first domestic manufacturer of large-scale and specialized production of silver powders. This series of products include: nano antibacterial silver powder, conductive flake silver powder, bright silver powder, conductive spherical silver powder, ultrafine silver powder, flake silver-coated copper powder, spherical silver-coated copper powder, dendritic silver-coated copper powder. Hongwu Nano has many years of professional and technical personnel engaged in the research and development and production of nano powders to provide technical support for the enterprises. At the same time, the company has established close cooperative relations with many domestic and foreign universities and research institutions to ensure the sustainable development of the company. Hongwu currently has an annual production capacity of 3 tons of nano silver powder and 5 tons of conductive silver powder. https://www.hwnanomaterial.com/