Capacitor Grade Ta Tantalum Nanoparticles

Tantalum Nano Powder with the characteristic of slushing which use for the electronics and chemical industries.

Nano Graphene can be used For Electrochemical Sensor for its excellent high specific surface area, excellent electrical conductivity and biocompatibility, etc..High quality graphene with different specification are supplied by Hongwu Nano, a manufacturer since 2002.

99.99% pigment and polishing used Tin Dioxide Nanoparticle available in 20nm,mini order is 100g.

Cuprous Oxide Nano Powder have yellow brown color and mainly used in the antibacterial.

Silicon carbide has the characteristics of corrosion resistance, high temperature resistance, high strength, good thermal conductivity, and impact resistance. At the same time, it has the advantages of high thermal conductivity, oxidation resistance, and good thermal stability. It is often used in packaging materials in the microelectronics industry.

Nano zirconium dioxide zro2 powder, widely used as detal powder and ceramic powder,size could supply with nano size and micron size.

Hydrophobicity Rutile Titanium oxide nanopariticles available in 30-50nm with the purity of 86%．

Silicon nanoparticles could supply in 100nm or 200nm with 99.9% purity, brown black powder, widely used in high temperature coatings.

Carbon nanotubes including single-wall, double-wall, multi-wall have high sensitivity, electrical catalysis. CNTs with different functional groups, diameter, length, and dispersion are available.

Footballene C60 is widely used in diamond thin film growth and super lubricant.

High filling & low viscosity flake silver powders for epoxy resin conductive adhesive use       Conductive adhesive is a special kind of adhesion agent, mainly composed of resin and conductive fillers, such as silver powder, gold powder, copper powder, nickel powder, graphite powders, etc.), can be used as adhesive materials in microelectronics components, encapsulation manufacturing process.         Conductive adhesive with flake silver powder has excellent electrical conductivity, adhesion and chemical stability. Silver powder almost not be oxidized in the rubber, in air its oxidation speed is very slow, even if is oxidized, silver oxide generated still has good electrical conductivity. therefore, in the market, especially on the high reliability requirements of electric installation, flake silver powders as conductive filler is used mostly. And in the choice of matrix resin, epoxy resin is the best because of its high content of active group, high cohesive strength, good adhesion and excellent mechanical properties.       HW NANO flake silver powder, with particle size <1um, 1-3um,5-8um,10um, purity 99.99%. Specific surface area and apparent/bulk density are adjustable flexibly. It is available with small quantity for researchers and bulk order for industry groups.          Silver powder filling quantity influence on the properties of conductive silver glue. after silver powders as conductive filler is added to the epoxy adhesive, the conductive mechanism is the contact between of silver powders.After system curing, silver powders connect into chain circuit with each other, presents the conductivity. the data shows that the adding quantity of silver powder to 80% or so, the conductivity is the best.  

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you