High Quality Ruthenium nanowires RU NWs

SiC whiskers widely used in toughening metal matrix,ceramic matrix and polymer matrix composite.

Our beta silicon carbide nanopowder is in beta form, has nano size,micron size and sub-micron size.

China leading factory direct offer C60 powder, with favorable price and good quality

Nano Fe2O3 Powder with stability ,soluble in hydrochloric acid and nonmagnetic

Nano grade copper particles is available in 20nm,40nm,70nm or more bigger,widely used in sintering additives.

China factory direct offer gold (Au) nanoparticles powder 99.95% high purity, 20-30 nm small size, good and stable quality. Customize for 20nm-1um and nano gold water dispersion is OK. Any need welcome to contact us.

China factory direct offer 5:5 CuNi alloy powder, with ultrafine size, good sphericity, and favorable factory price. Any need welcome to inquiry.

Hongwu International Group Co., Ltd. has been a nanomaterial manufacturer since 2002.Nano-Silicon Dioxide can be used in the ceramic industry, etc., 20-30nm, with a purity of 99.8%.

China factory W-VO2 tungsten doped vandium oxide powder, phase change temperature was reduced from 68℃ to 20℃, can be applied for smart window materials, switching devices, temperature sensors, etc.

 Boron Carbide available in 1-3um with 99% purity could use in the ceremic materical and so on.

Since 2002 China factory offer spherical morphology Si nanopowders in good and stable quality, both sample orders and batch orders are available. Any need welcome to inquiry. 

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you