MoS2 Powders Molybdenum Disulfide Nanoparticles for solid lubricating materials

Silver nanowires, not only supply in powder form, but also supply in dispersion form, like propanol dispersion, water dispersion.

Silver Coated Copper Powder is a high conductive material and have good Antioxidant performance.

Double walled carbon nanotubes can be dispersed in water to make aqueous dispersion for easier use as required. DWCNT water dispersion can be customized as per requirements for better application.

silicon nanopowders with high purity as the lithium battery anode material .

Nano silver wire conductive ink is a transparent conductive ink specially designed and manufactured by Hongwu Nano on the basis of the self-developed silver nanowires, with the adjustable diameter between 30nm-100nm). AgNW conductive inks can be coated on different surfaces to achieve good conductivity. The transparent conductive film is made of Ag nanowire inks and then made into a touch module, which has become the technical core of flexible and transparent touch.

HW nanomaterial is supply Tin Bismuth (Sn42-Bi58) alloy Nanopowder / Nanoparticles, ,100nm, 99.9%

Iridium nanoparticle, 20-30nm, 99.99% purity, generally store in glass bottle, black liquid. Nano Ir stored in deionized water, it would be easier to disperse as well as safer delivery.

AZO nanopowder is widely used in conductive antistatic coating.

Tungsten Carbide Cobalt Powder (WC-Co) have 60nm with 99.9% purity . 

White Tin Dioxide Nanopowders have the feature of the excellent conductive performance use for manufacturing the electrical contact materials.

Ultrafine Nickel powders for MLCC electrode have narrower particle size distribution and good spherical particles. Worldwide shipping.

Silicon carbide has the characteristics of corrosion resistance, high temperature resistance, high strength, good thermal conductivity, and impact resistance. At the same time, it has the advantages of high thermal conductivity, oxidation resistance, and good thermal stability. It is often used in packaging materials in the microelectronics industry.