Silicon Nano wires/rods used as sensors in biomedical detection applications

Hongwu Silicon nanowires SiNWs(D 100-200nm L>10um) are widely used in lithium-ion batteries, solar cell, thermoelectricity, photovoltaic and non-volatile memory applications. in stock, shipping to worldwide.

As a typical representative of one-dimensional nanomaterials, silicon nanowires not only have the special properties of semiconductors, but also show physical properties such as field emission, thermal conductivity and visible light luminescence that are different from bulk silicon materials. Si nanowires have huge potential application value in devices and new energy.

TiN nanopowder dispersed in the coating system, formed of TiN thin film which used for energy-saving glass coating.

Fullerol Fullerenols is a derivative of fullerene C60, which is obtained by chemically introducing hydroxyl groups into the carbon of fullerene.

China factory direct offer quality nano Sn powder Tin nanoparticles, 99.9% high purity,  70nm / 100nm / 130nm. Nano Sn can be applied for lubricant additives.

Nano Bismuth Powder is easy to disperse and have high oxidation temperature.It also has good sintering contractility and mainly used in metallurgy industry,lubricating oil additive and magnetic materials.

Hongwu Nano produces HBN mainly in 100-200nm, 0.8um, 1-2um and 5-6um with 99%-99.8% prutity.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you

Hongwu International Group Ltd supplys multi sizes of hexagonal boron nitride powders. High, and stable quality, competitive price and service, suitable for huge scale application

Silicon Dioxide with the size of 10-20nm, 20-30nm with the purity of 99.8% as the  electret material .

we supply the Silicon Nitride Powder  alpha in micron size 99.9% -99.99%.

Our Antimony Tin Oxide nanopowders(ATO <10nm) is widely used in transparent antistatic coatings basis on highly dispersion.