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Thermal Management of Boron Nitride Nanosheets in Polyurethane (PU) Matrix

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Thermal Management of Boron Nitride Nanosheets in Polyurethane (PU) Matrix

As an outstanding thermal conductive material with excellent processability, stability and electrical insulation, ultrathin boron nitride nanosheets are widely used in heat dissipation in electronic fields such as semiconductor packaging. In stock. Contact us for data sheets and a quotation.

  • product origin:

    CN
  • shipping port:

    Hongkong, Shanghai
  • color:

    White or off white
  • lead time:

    in stock
  • payment:

    T/T, PAYPAL,Others
pPoduct Details

Name:Boron Nitride Nanosheets (ultra-thin)

Formula:BNNS
Thickness:<10nm & <50nm &<100nm
Diameter:about 1um, customizable
Purity: 99%+
Color:white & off-white
CAS No.: 10043-11-5

Advantage : 

Thermal Conductivity
Stability
Processability
Electrical Insulation
Low Dielectric Loss


Thermal Management Applications of Boron Nitride Nanosheets in Polyurethane (PU) Matrix


The composite system of boron nitride nanosheets and polyurethane matrix has become a hot spot in the application of thermal management materials, relying on the synergistic complementarity of both in thermal conductivity, insulation, and mechanical properties.

Boron nitride nanosheet is a two-dimensional layered nanomaterial with excellent thermal conductivity of high in-plane thermal conductivity, combined with excellent thermal stability and chemical stability.
As a flexible polymer matrix, polyurethane has adjustable mechanical strength, good low-temperature flexibility, wear resistance and substrate adhesion.
Introducing boron nitride nanosheets into the polyurethane matrix can significantly improve the thermal conductivity of the composite material while maintaining the flexibility and insulation characteristics of the polymer, meeting the demand for high-performance thermal management materials in electronic packaging, flexible electronics and other fields.

The composite material of boron nitride nanosheets and polyurethane has shown broad prospects in many fields.

In the field of electronic packaging, it can be used as a thermal interface material for chips and LED lights to effectively reduce interface thermal resistance.


In the field of 5G equipment cooling, it can meet the severe thermal management requirements of high power density devices.


In the field of flexible electronics, it is suitable for heat-conducting substrates of wearable devices and flexible circuit boards.


In the field of flame retardant coatings, it can realize the synergy of heat conduction and flame retardant functions.


In addition, combined with phase change materials, it can also be used for personal thermal management, such as temperature-controlled clothing.

Looking forward to the future, the thermal management applications of boron nitride nanosheets in polyurethane matrix will develop in the following directions.


1. the refined construction of three-dimensional heat conduction networks, evolving from single filler orientation to multi-dimensional heat conduction path design.

2. the precise control of anisotropic heat conduction, and the optimization of directional heat dissipation paths through external field induction.
3.  the integrated design of multiple functions to achieve collaborative improvement of heat conduction, flame retardancy, electrical insulation and flexibility.
4. green coatable technology to promote the industrial application of water-based polyurethane-based heat-conducting coatings.

5. breakthroughs in large-scale preparation technology, promoting the industrial promotion of efficient exfoliation technologies such as microfluidization.


These development directions will promote boron nitride nanosheets and polyurethane composite materials to play a more important role in the field of thermal management.


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