Ultrafine SnBi alloy nanoparticles 100nm Tin Bismuth Alloy powders

HW nanomaterial is supply Tin Bismuth (Sn42-Bi58) alloy Nanopowder / Nanoparticles, ,100nm, 99.9%

Hongwu is supplying fusible alloy nano SNBI material, 200-300nm, 300-500nm, 1-3um, etc. after heating melting the alloy has good fluidity, so this kind of low melting point metal is also widely used to use the mold by casting method. Fell free to contact us at hwnano@xuzhounano.com, thank you.

HONGWU NANO has been manufactured and exported nanoparticles since 2002, precious metal and its oxide nanoparticles powder are our advantaged and hot sell item. Both small quantity and batch production is OK.  Mature and stable production process and quality, ultrafine particle size 20-30nm, high purity 99.95%. With good catalyst performance, any need welcome to inquiry.

High filling & low viscosity flake silver powders for epoxy resin conductive adhesive use       Conductive adhesive is a special kind of adhesion agent, mainly composed of resin and conductive fillers, such as silver powder, gold powder, copper powder, nickel powder, graphite powders, etc.), can be used as adhesive materials in microelectronics components, encapsulation manufacturing process.         Conductive adhesive with flake silver powder has excellent electrical conductivity, adhesion and chemical stability. Silver powder almost not be oxidized in the rubber, in air its oxidation speed is very slow, even if is oxidized, silver oxide generated still has good electrical conductivity. therefore, in the market, especially on the high reliability requirements of electric installation, flake silver powders as conductive filler is used mostly. And in the choice of matrix resin, epoxy resin is the best because of its high content of active group, high cohesive strength, good adhesion and excellent mechanical properties.       HW NANO flake silver powder, with particle size <1um, 1-3um,5-8um,10um, purity 99.99%. Specific surface area and apparent/bulk density are adjustable flexibly. It is available with small quantity for researchers and bulk order for industry groups.          Silver powder filling quantity influence on the properties of conductive silver glue. after silver powders as conductive filler is added to the epoxy adhesive, the conductive mechanism is the contact between of silver powders.After system curing, silver powders connect into chain circuit with each other, presents the conductivity. the data shows that the adding quantity of silver powder to 80% or so, the conductivity is the best.  

Superfine Zirconia ZrO2-3Y powders specific surface and size can be controlled as per customer's demand.

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