high quality -OH and -COOH functionalized single walled carbon Nanotubes SWCNT

Black graphene oxide as the catalytic materials apply to the chemical industry.

HW NANO bulk supply High density ultra fine pure tungsten metal powders.

Thermal conductive filler nano alumina for LED encapsulation heat dissipation         It should put the heat conduction in the first place when heat dissipation of high power LED encapsulation is designed, because the heat conduct to the radiator from the LED packaging module first.Therefore,the bonding material, substrate is the key link of the LED heat dissipation technology.       Bonded materials mainly include thermal conductive glue, conductive silver slurry and alloy solder.Thermal conductive adhesive is to add some of the high thermal conductivity filler to the matrix, such as SiC, A1N, A12O3, SiO2, to improve the thermal conductivity.       the alpha nano alumina thermal conductive powder that HW NANO produces, high spheroidization rate,the small particle size, high purity, high thermal conductivity,used for thermal conductive filler such as epoxy resin, rubber, plastics, semiconductor packaging.       Alpha nano alumina, al2o3, particle size 200nm, 300nm, 500nm, 800nm, 1um... white solid powder, they are are all available with small quantity for researchers and bulk order for industry groups. 1kg per bags or 25kg per bucket or as needed for packing. application of nano alumina thermal conductive powder: 1. Thermal plastic. Adding the alumina powder can increase the coefficient of thermal conductivity of polypropylene (PP), and the coefficient of thermal conductivity of alumina/PP composite materials increase with the increase of dosage of thermal conductivity of alumina powder. 2. Thermal conductive silicone rubber.  Add the nano alumina powder can improve the coefficient of thermal conductivity of silicone rubber, and will not affect the transparency, appropriate adding quantity can make the coefficient of thermal conductivity of silicone rubber arrive 1.48-2 W/(m • K). 3. Heat conduction glue adhesion agent, such as agent of epoxy resin, epoxy resin, the thermal conductive coatings, etc., to add the alumina powder can make the coefficient of thermal conductivity arrive 0.6 W/(m • K) above. 4. Organic silicon thermal binder and mixture filler, radiator, radiator substrate with filler (MC), thermal oil, phase change, semiconductor packaging resin. If you have any questions about nano Alumina powder/aluminum oxide powder, please feel free to contact me. thank you

Our silicon nitride powder is in alpha phase, high purity from 99.9%-99.99%, widely used in ceramic materials.

Superfine 20nm nano tin oxide powders is widely used in gas sensor materials.

Copper nanowires, with diameter 100-200nm, length >5um, high conductive, good dispersed, widely used in thin film solar cells.

Nano silica (SiO2) powder has a large specific surface area and many surface active centers, and thus it has potential application value in catalysts and catalyst supports.

Nanowires of Ruthenium are a promising candidate for studying the intrinsic behavior of individual one-dimensional superconducting wires. 

zero valent iron nanopowder ( ZVI ) is element metal Fe nanopowder. HW have 20nm, 40nm, 70nm, 100nm at offer

Nano zirconia polishing powder, high purity, white powder, is stainless steel, glass, stones, crystal, metal, all kinds of stone series of fine polishing materials.

HW NANO supply yttria stabilized zirconia (YSZ) of the highest quality and purity at a competitive price.

The product has high purity, small particle size and large specific surface area. Its surface activity is high, UV shielding is more than 80%, and it has good barrier properties. The material has good electrical conductivity and can be used as a conductive material for electrodes and electrical contacts of molten salt electrolysis.