Molybdenum Nanoparticles 70nm 99.9% Mo powder CAS 7439-98-7

Molybdenum Nanopowders are available in 40nm, 70nm, 100nm, 130nm with the purity of 99.9% .

Molybdenum Mo Nanoparticles is widely used in metal additives.

Hongwu nanomaterial is supplying high purity metal molybdenum powder (Mo) , has passed tests, such as REACH,RoHS,halogen. widely used in raw materials of molybdenum alloy products, electric heating elements and powder metallurgy, high temperature resistant alloys, sintering of molybdenum products, diamond tools and so on. Contact us for detailed info.

Nano Mo Molybdenum Powder have good stability in the air,large specific surface area,high sintering activity,with high temperature intensity and high temperature hardness.

Molybdenum nanopowder, could be available at 40nm, 70nm, 100nm, 130nm with 99.9% purity, could also supply micron size at 2um.

The biggest advantage of nano-tungsten oxide in the field of thermal insulation is its excellent spectral selectivity - it can effectively block near-infrared thermal radiation while maintaining high visible light transmittance. This makes it irreplaceable in transparent thermal insulation applications (such as building and automotive glass). In addition, its low thermal conductivity, high specific surface area, chemical stability and good compatibilities also make it a very potential multifunctional thermal insulation material additive or coating material. With the continuous advancement of nanotechnology and preparation technology, its application prospects will be broader.

Ag coated Cu powder widely used in conductive paste, conductive filler, conductive ink.

Silicon carbide whiskers, diameter ：0.1～2.5μm, length：10-50um, purity 99+, gray-green. Chemical properties: wear resistance, high temperature resistance, especially thermal shock resistance, corrosion resistance, radiation resistance.

The ceramic sealing parts are superior to other materials in chemistry corrosion proof, wear resistance, thermmostability and so on.

High filling & low viscosity flake silver powders for epoxy resin conductive adhesive use       Conductive adhesive is a special kind of adhesion agent, mainly composed of resin and conductive fillers, such as silver powder, gold powder, copper powder, nickel powder, graphite powders, etc.), can be used as adhesive materials in microelectronics components, encapsulation manufacturing process.         Conductive adhesive with flake silver powder has excellent electrical conductivity, adhesion and chemical stability. Silver powder almost not be oxidized in the rubber, in air its oxidation speed is very slow, even if is oxidized, silver oxide generated still has good electrical conductivity. therefore, in the market, especially on the high reliability requirements of electric installation, flake silver powders as conductive filler is used mostly. And in the choice of matrix resin, epoxy resin is the best because of its high content of active group, high cohesive strength, good adhesion and excellent mechanical properties.       HW NANO flake silver powder, with particle size <1um, 1-3um,5-8um,10um, purity 99.99%. Specific surface area and apparent/bulk density are adjustable flexibly. It is available with small quantity for researchers and bulk order for industry groups.          Silver powder filling quantity influence on the properties of conductive silver glue. after silver powders as conductive filler is added to the epoxy adhesive, the conductive mechanism is the contact between of silver powders.After system curing, silver powders connect into chain circuit with each other, presents the conductivity. the data shows that the adding quantity of silver powder to 80% or so, the conductivity is the best.  

Superfine high active tin nanopowders widely used in conductive coating.

Cu-Zn alloy nanopowders, particle size ＜150nm, Cu:Zn=65:35 / 5:5. ratio adjustable, factory price. If need other particle size,kindly contact us for customize service to check feasibility, thanks.