Preparation of the production of microelectronic components wiring,packaging, connectors and other electronic slurry, make miniaturization of microelectronic devices and circuit miniaturization. The conductive paste is animportant raw material of industrial electronics. Domestic research institutions to replace the use of nano silver powder made of micron conductive silver paste, you can save 30% of silver.

Since the nanoparticles is typically less than the melting point of the solidmaterial, e.g., a melting point of silver is about 900 ℃,while the melting point can be reduced to silver nano 100 ℃,thus forming an electroconductive nano-silver paste can be sintered at low temperatures, even in the plastic other low-temperature materials for the substrate.

Silver and coinssheet is widely used in the electronics industry. In which the role of silveras a conductive adhesive: membrane touch switch (MTS), low-temperature ceramic(LTCC), a plasma display panel or the like. Demand for highly integratedelectronics manufacturing production contributed to a smaller silver particles and a specific particle size distribution.

Silver and silver pieces for the microelectronics industry have more than 40 years. Since silver has high conductivity, and the natural thermal conductivity and oxidation resistance. May silver powder and silver flake consumption to be higher than110 tons of metal. Applications are currently being hot and prospects reflectthe commercial value of silver nanoparticles.

Sandia National Laboratorystudies show that the nano silver from the sintering temperature can be reducedto 850 degrees Celsius to 250 degrees Celsius. * Thermal order of less than 10° C temperature may be less than 250, less than 5 * may be lower than the temperature of the order of 300 degrees Celsius. Disadvantages found in the microstructure of sintered stress crack defects. The formation of cracks and the heating rate related. And the heating rate can be adjusted by controlling the power to achieve improved packing density.

With more surfactant and materials in commerce, research will gradually increase. Rheological and electrical properties of surfactants on the silver surface adhesion great influence with the increase in the application of nano-silver, nano-particles brings the benefits will be more apparent.

Nano-silver is very wonderful world.There are various methods for preparing nanoparticles for different purposes.Nanotechnology large number of tests can only be effective under the right circumstances. It can be said, with the accumulation of experience inproduction, the cost of nano-silver will continue to be reduced. Tests showed that nano-silver can effectively reduce the sintering temperature. In polymer production, nano silver also need to proceed further.

Howgwu nano production silver nanoparticle size at 20nm,30-50nm, 50-80nmwith 99.99% purity. Also has micron size such as 1-2um or 3-8um particle size,for further information, please contact us at hwnano@xuzhounano.com.